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ADIN3310 adi

數據:

Ethernet MAC interfaces: 10 Mb, 100 Mb or 1 Gb per port 6-port: 4x RMII/RGMII/SGMII and 2x RMII/RGMII3-port: 2x RMII/RGMII/SGMII and 1x RMII/RGMII SGMII, 1000BASE-SX/1000BASE-LX/1000BASE-KX, and 100BASE-FX Low Latency Layer 2 Ethernet switch Deterministic latency from port to portCut-through or store and forward operation Traffic types and bridge delay per IEEE/IEC 60802 Standard bridging per IEEE 802.1Q-2018 (tailored) Each port is nonblocking and Independent 32 kB frame buffer per transmit port 4096 VLANs Time synchronization IEEE 802.1AS-2020 IEEE 1588-2019 default profile IEEE C37.238-2017 energy profile 8 ns timestamp resolutionFrames timestamped on ingress or egress IEEE 802.1Q time sensitive networking bridgingQbv: enhancements for scheduled traffic Qci: per stream filtering and policing Qbu: frame preemption Qch: cyclic queuing and forwarding Qav: forwarding and queuing enhancements Qcc: stream reservation protocol enhancements Number of streams 16000 TSN Layer 2 streams 256 extended lookup streams (IPV4, IPV6, PCP, and so on)PROFINET SendList control High availability and redundancy IEEE 802.1CB Frame Replication and Elimination for Reliability IEC62439-3:2016-03 HSR-/PRP-Compliant Protocol for Seamless Failover IEC62439-3-2021-12 Media Redundancy Protocol Custom Layer 2 on two ports for PROFINET IRT, EtherNet/IP beacon-based DLR, POWERLINK (100 Mbps) Packet assist engine offloads host and manages TSN and switch features Portable C drivers for TSN and industrial Ethernet protocols NETCONF support (driver to Sysrepo translation layer) Hardware root of trust based security features Secure boot, secure update with antirollback Hardware-based cryptography Secure host pairing Protocol Cryptographic authenticity checking Interfaces to external host processor RMII, RGMII, SGMII, SPI, dual SPI, or Quad SPI Power 3 external power supplies: 1.1 V, 3.3 V, and VDDIO_x (1.8 V, 2.5 V, or 3.3 V) Total chip power 60 mW per port at 1 Gbps, full utilization with VDDIO_B = 1.8 V Package and temperature range 256-ball CSP_BGA, 14 mm × 14 mm, 0.8 mm pitch196-ball CSP_BGA, 12 mm × 12 mm, 0.8 mm pitch Fully specified for ?40°C to +85 and ?40°C to 105°C The ADIN3310 and ADIN6310 are 3-port and 6-port Gigabit Ethernettime sensitive networking (TSN) switches with integrated securityprimarily designed for industrial Ethernet applications. Each portcan be configured to operate at different speeds. These switcheshave uncommitted media access controller (MAC) interfaces andcan be paired with Analog Devices, Inc., physical (PHY) layerdevices such as ADIN1100, ADIN1200,and ADIN1300, to form alow power, low latency system. Four serial gigabit media independentinterface (SGMII) and serializer/deserializer (serdes) interfacesallow backplane connections, connectivity to SFP modules andcascade switches. The switch supports the suite of IEEE 802.1Qtime sensitive networking bridging features required by IEEE 60802standard providing quality of service (QoS) for latency sensitivestreams. The device also includes hardware capability to supportparallel redundancy protocol (PRP) or high availability seamlessredundancy (HSR) redundancy protocols, thereby offloading thehost processor.APPLICATIONSFactory and process automation Motion control, robots, and cobots Energy automation Transportation Instrumentation Building automation