大功率led的熱模擬

　　計(jì)算流體動(dòng)力學(xué)（CFD）建模的發(fā)光二極管（LED）組件已經(jīng)變得越來(lái)越重要，因?yàn)樗F(xiàn)在被應(yīng)用到設(shè)計(jì)過(guò)程中。本文比較了Avago的高功率LED封裝的結(jié)果（asmt-mx00）在金屬芯印刷電路板（MCPCB）和雙層FR4基板與散熱器的實(shí)驗(yàn)數(shù)據(jù)。在比較討論之后，指出了帶有散熱片的LED封裝的熱模擬技術(shù)。結(jié)果令人印象深刻，表明這種技術(shù)可用于LED系統(tǒng)級(jí)。

　　I. Introduction

　　The prediction of the thermal performance of LEDs is becoming a necessity in reducing the time it takes to bring products to market. However， with increasing heat flux and package density， heat dissipation of the LED package module is becoming a challenge; therefore， the thermal analysis and design of the module is becoming even more critical. CFD simulation is a widely used method for thermal analysis of electronic products in the early design stage. CFD is concerned with the numerical simulation of fluid flow， heat transfer， and other related processes such as radiation.

　　This paper presents work done to create a high power LED package on an MCPCB with heat sink and a double layer FR4 with heat sink. First， a detailed model of an LED package-on-substrate is created. Then a heat sink is created on the bottom of the LED package. Finally， this simulation data is compared to experimental data.